A new kind of technical conference and trade show, developed for and by the high-frequency/high-speed electronics industry and Microwave Journal China.
June 15, 2012:
Conference registration opens. Early registration discount ends 12/31/12.
August 1, 2012:
Deadline for Papers and Workshop Submittal
Sept. 30, 2012:
Acceptance of Papers
Nov. 1, 2012:
Final Conference Program
March 12-14, 2013:
Electronic Design Innovations Conference
EDI CON 2016
April 19-21, 2016 Beijing, China
EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.
The sessions offered are designed to provide knowledge of electronic design tools and techniques. The technical sessions are divided into three concurrent technical tracks. Each session will feature two twenty-minute long technical papers from invited contributors or selected from papers submitted to the EDI CON Technical Advisory Committee. The technical tracks focus on a range of high frequency/high speed electronic design issues from component characterization through system integration.
3 Day peer-reviewed industry-focused technical conference
95 peer reviewed papers
2 panel sessions
7 keynote talks from Industry executives, leading researchers and academics
Invited and submitted papers are reviewed by the EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of EMC, circuit and system simulation, test verification, RFIC, MMIC and high-speed semiconductors, passive components, and system integration. The technical sessions are organized around tracks focused on RF, microwave and high-speed digital design, RF/mW measurement and modeling, EMC/EMI, high-speed digital measurements and modeling, system-level measurements and modeling, system engineering and commercial resources.
Workshops provide a forum for industry practitioners to share information on specific challenging and emerging topics related to high-frequency/high-speed electronic design. Workshop sponsors are responsible for developing the content according to the guidelines set by the EDI CON organizers. Workshops are an interactive experience, allowing extra time for audience questions and participation, which may include demonstrations and opportunities to work with design software and/or measurement equipment.
EDI CON 2015 will feature special expert panels discussing specific topics impacting technology today. Led by a moderator with interaction from audience members, experts will provide a brief overview of their position on the challenges and potential solutions impacting a specific technology or application. Past panel themes included the State of GaN in China, MIMO OTA test, EDA design flows, Aligning RF semiconductor technology to end-use applications, and Trends in future telecommunications systems and their engineering challenges.
EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. This year’s exhibition doubles the size of 2013 with twice the exhibition space and number of exhibitors. The exhibition halls feature test and measurement equipment and simulation software (EDA) vendors in the west hall and semiconductor, integrated device manufacturers, materials, components and distributors in the east hall. A schedule of events in the exhibition will ensure a lively and productive exchange between vendors and attending engineers.
November 30, 2014: Material deadline for submitting paper proposals
December 30, 2014 - Notification of acceptance
February 28, 2015 - Final materials due
March 31, 2015 - Registration discount ends
EDI CON China 2015 Sets Record for Attendance April 29, 2015 – Norwood Massachusetts: Horizon House Publications and Microwave Journal China are pleased to announce that 2625 total attendees visited EDI CON China 2015 in Beijing, April 14-16, at the China National Convention Center (CNCC), significantly exceeding the previous two years attendance numbers. This included 1214 delegates attending the conference and exhibition. The plenary session drew close to 300 attendees with about 350 attending the Keysight sponsored reception dinner. Read More
Richardson RFPD Announces Participation and Sponsorships at EDI CON 2015 April 7, 2015 – Norwood Massachusetts:
Richardson RFPD announces their attendance and participation at EDI CON 2015, including sponsorships of the GaN Panel and Small Cell Workshop. Read More
Richardson RFPD Announces Sponsorship of Small Cell Workshop at EDI CON 2015 April 1, 2015 – Norwood Massachusetts:
Richardson RFPD announced its sponsorship of a small cell workshop at the 2015 Electronic Design Innovation Conference (EDI CON 2015). EDI CON 2015 will be held from April 14 -16 at the China National Convention Center in Beijing, China. Richardson RFPD's small cell workshop is scheduled for Wednesday, April 15, from 2:15 p.m. to 2:55 p.m., local time, in room 406 of the Convention Center. Read More
EDI CON exhibitors are at the forefront of high frequency electronic design, providing the technology solutions and products that are used by engineers in the design of next generation systems addressing the telecommunications, computing, aerospace and wireless consumer electronics sectors.