A new kind of technical conference and trade show, developed for and by the high-frequency/high-speed electronics industry and Microwave Journal China.
June 15, 2012:
Conference registration opens. Early registration discount ends 12/31/12.
August 1, 2012:
Deadline for Papers and Workshop Submittal
Sept. 30, 2012:
Acceptance of Papers
Nov. 1, 2012:
Final Conference Program
March 12-14, 2013:
Electronic Design Innovations Conference
Registration Now Open!
Registration to attend the EDI CON 2014 technical conference and exhibition, April 8-10 in Beijing China is now open. This 3 day industry-driven event focuses on RF/microwave and high-speed digital design. Entrance into the technical program, workshops/tutorials, panel sessions and opening day ceremonies are all inclusive when purchasing a delegate pass. Register early and save 50% on the admission price
April 8-10, 2014 Beijing, China www.EDICONCHINA.com
EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.
The EDI CON 2014 plenary sessions will open the EDI CON technical program on April 8th at 9:30 am in the Beijing International Conference Center’s main auditorium. Two sessions will feature guests from leading research institutes, universities and industry with opening remarks from this year’s Chair Emeritus, Dr. Professor Song Junde of the Beijing University of Posts and Telecommunications. Also featured in the opening plenary session will be Dr. Erping Li, Chair Professor RF and Nanoelectronics Research Center, Zhejiang University and Keming Feng, General Manager, Beijing Institute of Radio Metrology and Measurements. The second plenary session will examine current and future trends in telecommunications with keynote talks from Corbett Rowell of China Mobile Research Institute, Deng Jie from ZTE Microwave Products and Mr. Josef Wolf, Director of Spectrum/Network Network Analysis and EMC, Rohde & Schwarz.
3 Day peer-reviewed industry-focused technical conference
86 peer reviewed papers
5 panel sessions
1 Agilent Education forum
8 keynote talks from Industry executives, leading researchers and academics
Invited and submitted papers are reviewed by the EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of EMC, circuit and system simulation, test verification, RFIC, MMIC and high-speed semiconductors, passive components, and system integration. The technical sessions are organized around tracks focused on RF, microwave and high-speed digital design, RF/mW measurement and modeling, EMC/EMI, high-speed digital measurements and modeling, system-level measurements and modeling, system engineering and commercial resources.
Workshops provide a forum for industry practitioners to share information on specific challenging and emerging topics related to high-frequency/high-speed electronic design. Workshop sponsors are responsible for developing the content according to the guidelines set by the EDI CON organizers. Workshops are an interactive experience, allowing extra time for audience questions and participation, which may include demonstrations and opportunities to work with design software and/or measurement equipment.
EDI CON 2014 will feature five special expert panels discussing specific topics impacting technology today. Led by a moderator with interaction from audience members, experts will provide a brief overview of their position on the challenges and potential solutions impacting a specific technology or application. Panel themes will include the State of GaN in China, MIMO OTA test, EDA design flows, Aligning RF semiconductor technology to end-use applications, and Trends in future telecommunications systems and their engineering challenges.
EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. This year’s exhibition doubles the size of 2013 with twice the exhibition space and number of exhibitors. The exhibition halls feature test and measurement equipment and simulation software (EDA) vendors in the west hall and semiconductor, integrated device manufacturers, materials, components and distributors in the east hall. A schedule of events in the exhibition will ensure a lively and productive exchange between vendors and attending engineers.
Extended Deadline: November 15, 2013 - Material deadline for submitting paper proposals, including title and abstract/summary, author bio/pic. initial drafts also accepted
November 30, 2013 - Notification of acceptance
December 31, 2013 - Final manuscript due
RFHIC Joins EDI CON 2014 as a Gold Sponsor December 10, 2013 – Norwood Massachusetts:
Horizon House publications and Microwave Journal China announced the participation of RFHIC, a global leader in the design and manufacture of RF & Microwave components, as a Gold sponsor of the 2014 Electronic Design Innovation Conference (EDI CON 2014) to be held April 8 – 10, 2014 at the Beijing International Convention Center in Beijing, China. Read More
EDI CON 2014 Gold Sponsors Offer Solutions for Next Generation Communication Systems in China November 10, 2013 – Norwood Massachusetts: Horizon House publications and Microwave Journal China announced the lineup of Gold-level sponsors for next year’s Electronic Design Innovation Conference (EDI CON 2014) to be held April 8 – 10, 2014 at the Beijing International Convention Center in Beijing, China. The Gold Sponsors - Anritsu, CST, Spirent Communications, Mini-Circuits, Richardson RFPD - are technology leaders in the areas of RF/microwave and high speed digital test equipment, simulation software, wireless network test solutions, component manufacturing and manufacturer representative/distributor, respectively. Read More
ETS-Lindgren Announces New Wireless Tech Tours in China October 24, 2013 – ETS-Lindgren, an industry leader in the design and installation of wireless over-the-air (OTA) test and measurement systems, announced three new Tech Tours in China: Shanghai on 4 November, Shenzhen on 5 November, and Beijing on 7 November. Tech Tours are half-day technical seminars with industry expert speakers, organized by ETS-Lindgren. The technical content of the China Tech Tours will focus on wireless test and measurement topics, including reverberation technologies for wireless OTA measurements, Long Term Evolution (LTE), Multiple Input, Multiple Output (MIMO) and Passive Intermodulation (PIM) testing. Read More
EDI CON exhibitors are at the forefront of high frequency electronic design, providing the technology solutions and products that are used by engineers in the design of next generation systems addressing the telecommunications, computing, aerospace and wireless consumer electronics sectors.