EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.
Keynote talks from Honorary Chair, Dr. Professor Song Junde of BUPT, Guy Sene, President of EMG, Agilent Technologies (Platinum Sponsor), Guang Yang, Senior Mobile Communications Analyst, Strategy Analytics, Bertrum Arbesser-Rastburg, Head ESA-ESTEC, Dr. Guangyi Liu, senior Researcher, China Mobile Research Institute, Deng Jie, General Manager, ZTE Microwave Products Group and Feng Keming, General Director Beijing Institute of Radio Metrology and Measurement.
The peer-reviewed technical paper sessions offer three tracks addressing:
Measurement & Modeling
Invited and submitted papers are reviewed by the EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of EM, circuit and system simulation, test verification, RFIC, MMIC and high-speed semiconductors, passive components, and system integration. In addition, the morning technical program will have a fourth track on commercial resources featuring sponsored papers. Download 2013 conference schedule
Workshops provide a forum for industry practitioners to share information on specific challenging and emerging topics related to high-frequency/high-speed electronic design. Workshop sponsors are responsible for developing the content according to the guidelines set by the EDI CON organizers. Workshops are an interactive experience, allowing extra time for audience questions and participation, which may include demonstrations and opportunities to work with design software and/or measurement equipment.
Workshops in development include:
TD-LTE 802.11ac Carrier Aggregation NFC High-Speed
Data Converters FPGAs for Wireless Communications
RFICs Front-ends SATCOM Radar Systems EMC/EMI
Forums feature presentations from a panel of experts followed by a joint question and answer session with audience members. Each 60 minute session will include three panelists, recognized for their expertise in their respective fields. Each panelist will give a 15 minute presentation on the challenges and potential solutions impacting a specific technology or application followed by a question and answer session. The conference organizers and individual panel sponsors are responsible for coordinating the panel topic and invited speakers.
Current scheduled forums include:
MIMO OTA (sponsored by Spirent)
The GaN Panel (90 minutes, limited to 5 co-sponsors)
Connectivity Forum (3 hour slot of technical sessions
EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other shows with a separate more academic focused conference, EDI CON has industrial and technology leaders delivering most of the technical sessions, workshops and panels so that the exhibition is closely coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.
Extended Deadline: November 15, 2013 - Material deadline for submitting paper proposals, including title and abstract/summary, author bio/pic. initial drafts also accepted
November 30, 2013 - Notification of acceptance
December 31, 2013 - Final manuscript due
EDI CON 2014 Gold Sponsors Offer Solutions for Next Generation Communication Systems in China November 10, 2013 Norwood Massachusetts: Horizon House publications and Microwave Journal China announced the lineup of Gold-level sponsors for next years Electronic Design Innovation Conference (EDI CON 2014) to be held April 8 10, 2014 at the Beijing International Convention Center in Beijing, China. The Gold Sponsors - Anritsu, CST, Spirent Communications, Mini-Circuits, Richardson RFPD - are technology leaders in the areas of RF/microwave and high speed digital test equipment, simulation software, wireless network test solutions, component manufacturing and manufacturer representative/distributor, respectively. Read More
ETS-Lindgren Announces New Wireless Tech Tours in China October 24, 2013 ETS-Lindgren, an industry leader in the design and installation of wireless over-the-air (OTA) test and measurement systems, announced three new Tech Tours in China: Shanghai on 4 November, Shenzhen on 5 November, and Beijing on 7 November. Tech Tours are half-day technical seminars with industry expert speakers, organized by ETS-Lindgren. The technical content of the China Tech Tours will focus on wireless test and measurement topics, including reverberation technologies for wireless OTA measurements, Long Term Evolution (LTE), Multiple Input, Multiple Output (MIMO) and Passive Intermodulation (PIM) testing. Read More
National Instruments/AWR named as corporate sponsors of EDI CON 2014
Horizon House Publications and Microwave Journal China announced that National Instruments (NI) and its fully-owned subsidiary AWR Corp. will be the corporate sponsors of the Electronic Design Innovation Conference (EDI CON) 2014 in Beijing, China April 8-10, 2014. Read More
EDI CON exhibitors are at the forefront of high frequency electronic design, providing the technology solutions and products that are used by engineers in the design of next generation systems addressing the telecommunications, computing, aerospace and wireless consumer electronics sectors.