EDI CON China 2017 Opens Call For Papers

August 1, 2016 (Norwood, Mass.) - EDI CON China 2017, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place April 25-April 27, 2017 at the Shanghai Convention Center & Exhibition Center of International Sourcing (Shanghai, China), announces the Call for Papers is open. Last year’s 3000+ attendees at EDI CON China attended technical conference sessions and visited exhibitors from the RF, microwave, and high-speed digital industries. Authors wishing to submit and abstract can do so here: http://www.ediconchina.com/callforpapers.asp

Focused on providing actionable information to practicing engineers, EDI CON offers specialized conference tracks to appeal to engineers looking for in-depth technical information to help on the job today. Planned tracks include RF & Microwave Design, High-Speed Digital Design, Measurement & Modeling, Systems Engineering, 5G Advanced Communications, EMC/EMI, IoT Design, and Radar Communications.

To be selected as part of the EDI CON China 2017 technical program, abstracts must provide a sufficient level of technical detail for the Technical Advisory Committee. Submissions should be high quality and detailed, aimed at advancing the knowledge of attendees. Abstracts will be evaluated on quality, relevance, impact, and originality. While prospective authors can reference products in a design case study or as a proof of concept for a design methodology, overt commercial content is not acceptable in session proposals.

Abstracts will be accepted until November 28, 2016 through the online portal system: http://www.ediconchina.com/callforpapers.asp

About EDI CON

EDI CON China uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today's communication, consumer electronics, aerospace, and medical industries.
Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, and poster sessions while the conference hosts educational talks and workshops that address all aspects of design, simulation, test, and verification.

About the Organizers
EDI CON China is organized by Microwave Journal and Microwave Journal China, the event planning division of its parent company Horizon House, and ACT International (Hong Kong), a publisher of BtB media in Asia serving multiple technology markets including Microwave Journal China. Horizon House is an experienced and well-established organizer of targeted events, including several major microwave related conferences/exhibitions such as EDI CON USA as well as the IEEE MTT-S International Microwave Symposium for 35 years (until 2009) and the European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), orchestrating these events’ long-term development and growth. The program is developed in collaboration with leading international technology companies in the areas of RF/microwave and high speed digital ICs, components, test and measurement, software, cables/connectors, systems, and services.

TECHNICAL PROGRAM CONTACT:
Janine Love, Technical Program Director
+1-857-350-2216
jlove@horizonhouse.com
Twitter: @tb_janine

SALES CONTACT:
Carl Sheffres, Publisher
+1-781-619-1949
csheffres@mwjournal.com

EVENT MANAGEMENT:
Michel Zoghob, Event Director
mzoghob@horizonhouse.co.uk

EDITORIAL CONTACTS:
North America:
Pat Hindle
+1 781 619 1946
PHindle@MWJournal.com
Twitter: @pathindle

International:
Richard Mumford
+44 207 596 8787
RMumford@MWJournal.com