February 1, 2017 (Norwood, Mass.) - EDI CON China 2017, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place April 25-April 27, 2017 at the Shanghai Convention Center & Exhibition Center of International Sourcing (Shanghai, China), announces the keynote speaker for this year’s event will be Peter Rabbeni, Sr. Director RF BU Product Marketing at GLOBALFOUNDRIES. Rabbeni will bring his significant insights on semiconductor technology to bear on his talk titled “Technologies for the Next Wave of Mobile Data.” In addition, the conference will host three specially moderated panels on some of the latest trending topics in the industry.
In his keynote talk, taking place during the plenary session on Tuesday, April 25th at 10:30AM in room 302, Rabbeni will talk about the higher performance and complexity needed in today’s networks and the mobile devices that they serve. He notes that each time we thought the end of Moore’s Law was near, an innovation in materials or processing enabled us to improve efficiencies. RF and high-speed digital applications have benefited from these advances, and innovations in tomorrow’s networks will likely rely on a broader adoption of these technologies. This talk will review the market dynamics and trends that led us to where we are and explores which technologies will play a transformational role in enabling the next wave of mobile data.
The EDI CON China conference will also host three discussion panel sessions, with opportunities for attendees to ask questions of industry experts. These panels include “Trends in Mobile Infrastructure,” moderated by Gary Lerude of Microwave Journal; “Which technology is better for the first 5G Systems: Massive MIMO sub-6 GHz or mmWaves?” moderated by Pat Hindle of Microwave Journal; and “Solid-State RF Energy in 2017: The volume breakthrough is finally there, is it not? “ moderated by Dr. Klaus Werner, executive director of the RF Energy Alliance.
Focused on providing actionable information to practicing engineers, EDI CON offers specialized conference tracks to appeal to engineers looking for in-depth technical information to help on the job today. Planned tracks include RF & Microwave Design, High-Speed Digital Design, Measurement & Modeling, Systems Engineering, 5G Advanced Communications, EMC/EMI, IoT Design, and Radar Communications. Last year’s 3000+ attendees at EDI CON China attended technical conference sessions and visited exhibitors from the RF, microwave, and high-speed digital industries. Attendees wishing to register for the event can do so here:http://www.ediconchina.com.
About EDI CON
EDI CON China uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today's communication, consumer electronics, aerospace, and medical industries.
Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, and poster sessions while the conference hosts educational talks and workshops that address all aspects of design, simulation, test, and verification.
About the Organizers
EDI CON China is organized by Microwave Journal and Microwave Journal China, the event planning division of its parent company Horizon House, and ACT International (Hong Kong), a publisher of BtB media in Asia serving multiple technology markets including Microwave Journal China. Horizon House is an experienced and well-established organizer of targeted events, including several major microwave related conferences/exhibitions such as EDI CON USA as well as the IEEE MTT-S International Microwave Symposium for 35 years (until 2009) and the European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), orchestrating these events’ long-term development and growth. The program is developed in collaboration with leading international technology companies in the areas of RF/microwave and high speed digital ICs, components, test and measurement, software, cables/connectors, systems, and services.
TECHNICAL PROGRAM CONTACT:
Janine Love, Technical Program Director
Carl Sheffres, Publisher
Michel Zoghob, Event Director
+1 781 619 1946