Winners announced in test & measurement, software/EDA, semiconductors, components and materials.
March 21, 2018 (Norwood, Mass.) - Last night, at EDI CON China 2018, the conference and exhibition that brings together engineers working on high frequency analog and high speed digital designs, the winners were announced in the EDI CON Innovation Awards. This award program honors products that have had the greatest impact on the industry this year, providing the tools necessary to bring on the next generation of electronic design innovations.
Winners were announced by Winson Xing, editor of Microwave Journal China, on the exhibit hall floor at EDI CON China on Tuesday, March 20 at the China National Convention Center in Beijing. Nominations were open to all exhibitors at EDI CON China 2018.
A panel made up of Microwave Journal and Signal Integrity Journal editors and EDI CON advisory board members determined 15 finalists and selected the winners. Entries were judged on innovation, including consideration of product functionality, ease of use, cost effectiveness and other factors.
Congratulations to the winners in the EDI CON China 2018 Innovation Awards:
Test & Measurement
Components, Cables and Connectors
Materials, PCBs and Packaging
About EDI CON
In its sixth year in 2018, EDI CON China uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today's communication, consumer electronics, aerospace, and medical industries.
Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, and poster sessions while the conference hosts educational talks and workshops that address all aspects of design, simulation, test, and verification.
About the Organizers
EDI CON China is organized by Microwave Journal, Signal Integrity Journal, and Microwave Journal China, the event planning division of its parent company Horizon House, and ACT International (Hong Kong), a publisher of BtB media in Asia serving multiple technology markets including Microwave Journal China. Horizon House is an experienced and well-established organizer of targeted events, including several major microwave related conferences/exhibitions such as EDI CON USA as well as the European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), orchestrating these events’ long-term development and growth. The program is developed in collaboration with leading international technology companies in the areas of RF/microwave and high speed digital ICs, components, test and measurement, software, cables/connectors, systems, and services.
Michel Zoghob, Event Director
Carl Sheffres, Exhibition Manager
TECHNICAL PROGRAM CONTACT:
Janine Love, Technical Program Director