EDI CON China Announces Innovation Award Finalists

Winners will be announced at the event on April 2nd in Beijing, China.

March 11, 2019 (Norwood, MA.) - EDI CON China 2019, taking place April 1-3, 2019 at the China National Convention Center (Beijing, China), has announced the finalists in the second annual EDI CON CHINA Product Innovation Awards.

The EDI CON Product Innovation Awards honor the products introduced in the last year that have had the greatest impact on the industry, providing the tools necessary to bring on the next generation of electronic design Innovations. Winners will be announced at 10:00 on Tuesday, April 2 in the Frequency Matters Theater (in the exhibit hall at the China National Convention Center). All finalists will receive signs for display in their booths at EDI CON CHINA 2019.

A panel of Microwave Journal and Signal Integrity Journal editors selected 15 finalists. Entries were judged on exceptional innovation, including consideration of product functionality, ease of use, cost effectiveness, and other factors. The categories included Test & Measurement; Software/EDA; Semiconductors; Components, Cables, & Connectors; and Materials, PCBs & Packaging.

EDI CON CHINA offers congratulations to the engineers and companies who developed these notable products:

Components, Cables, & Connectors Finalists:

  • TMY Technology Inc., Phase-locked oscillator
  • SAGE Millimeter, Ka Band Dual Polarized Choke Flange Feed Horn Antenna
  • Southwest Microwave, 1.0 mm Vertical Launch Compression-Mount PCB Connector

Software/EDA Finalists:

  • ANSYS Inc., HFSS R19.2
  • National Instruments/AWR, Network Synthesis Wizard
  • Polar Instruments (China) Ltd., Field Solving PCB Transmission Line Design System

Semiconductors Finalists:

  • Teledyne e2V, EV12AQ600 ADC
  • Analog Devices, ADRV9009 RF Transceiver
  • Anokiwave, 5G Gen-2 IC Family Supporting 3GPP Compliance

Test & Measurement Finalists:

  • Hongke Technology Co., LTD, Handheld Microwave Spectrum Analyzer for 70-87GHz
  • TMY Technology Inc., BBox
  • MITRON, 2-6GHz; 24-43GHz High Precision MIMO Phase & Amplitude Control Matrix

Materials, PCBs, & Packaging Finalists

  • Rogers Corporation, Thin RO4000® and New Foil Lamination Materials
  • Richardson RFPD, DE705 RF Front End Development Platform
  • WIN Semiconductors, MW plastic QFN Package Series

EDI CON CHINA begins with the Plenary Keynote Event at 10:00 on April 1. The exhibition opens immediately following the plenary keynote talks: Monday April 1 from 11:00-17:00 (Welcome Reception at 17:30); Tuesday April 2 from 9:30-17:00; and Wednesday April 3 9:30-13:00. Conference sessions, panels, and workshops take place all three days, beginning at 10:00 on April 1, 9:00 on April 2, and 9:30 on April 3.

More Information
Technical Program
Exhibitor List
Travel/ Venue


Celebrating its seventh year in 2019, EDI CON China uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today's communication, consumer electronics, aerospace, and medical industries. 
Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, and poster sessions while the conference hosts educational talks and workshops that address all aspects of design, simulation, test, and verification.  

About the Organizers
EDI CON China is organized by Microwave Journal, Signal Integrity Journal, and Microwave Journal China, the event planning division of its parent company Horizon House, and ACT International (Hong Kong), a publisher of BtB media in Asia serving multiple technology markets including Microwave Journal China. Horizon House is an experienced and well-established organizer of targeted events, including several major microwave related conferences/exhibitions such as EDI CON USA as well as the European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), orchestrating these events’ long-term development and growth. The program is developed in collaboration with leading international technology companies in the areas of RF/microwave and high speed digital ICs, components, test and measurement, software, cables/connectors, systems, and services.

Michel Zoghob, Event Director

Carl Sheffres, Exhibition Manager

Adonis Mak 
ACT International
(852) 28386298

Janine Love, Technical Program Director
Twitter: @tb_janine