EDI CON China
Organized by:
Horizon House Publishing
ACT International

A new kind of technical conference and trade show, developed for and by the
high-frequency/high-speed electronics industry and Microwave Journal China.

3 Day peer-reviewed industry-focused technical conference

  • 86 peer reviewed papers
  • 30 workshops
  • 5 panel sessions
  • 1 Keysight Technologies Education forum
  • 8 keynote talks from Industry executives, leading researchers and academics

Technical Papers

Tracks

  • RF, Microwave and High-speed digital design
  • RF/mW measurement and modeling
  • EMC/EMI, High-speed digital measurements and modeling
  • System-level measurements and modeling
  • System engineering
  • Commercial resources

Sessions (2-4 papers per session)

Tuesday, April 8th

  • TU101 - Envelope Tracking
  • TU102 - Harmonic Load-pull Techniques
  • TU103 - Spectrum Management and Analysis
  • TU104 - Multiple Antenna Test

Wednesday, April 9th

  • WE101 - RF/MW/HSD Circuit Design I
  • WE102 - RF/MW Measurement/Modeling I
  • WE103 - MIMO OTA Testing
  • WE104 - Global Navigation and Communication Satellite Systems
  • WE105 - Materials and PCBs 
  • WE201 - Power Amplifier Design and Linearization techniques
  • WE202 - Device modeling for PA design and stability analysis
  • WE203 - E-band and mmW System-level measurements, planning and synthesis tools
  • WE204 - RADAR and LTE MIMO Systems
  • WE205 - Materials, PCBs and Interconnects

Thursday, April 10th

  • TH101 - RF/mW passive component and antenna design
  • TH102 - Noise characterization techniques
  • TH103 - EMI, high-speed characterization and jitter analysis
  • TH104 - RADAR, Wide bandwidth systems, MIMO--OFDM and Phase Coherence
  • TH105 - MIMO wireless test and spatial channel modeling
  • TH201 - Antennas and antenna array design
  • TH202 - High power transistor characterization and thermal analysis
  • TH203 - Signal Integrity and gigabit channel measurements
  • TH204 - Radio planification, NFC, spectrum emission mask analysis and EMVCo testing
  • TH205 - Commercial resources

Panel Sessions

  • GaN Panel
  • Sponsored by Richardson RFPD
  • MIMO OTA Test Panel
  • Sponsored by Spirent Communications
  • EDA Design Flow Panel
  • Featuring Agilent Technologies, AWR, ANSYS, CST
  • Aligning RF semiconductor technology to end-use applications
  • Featuring OMMIC, Peregrine Semiconductor, WIN Semiconductor, Freescale
  • Trends in future telecommunications systems and their engineering challenges
  • Moderated by Guangyi Liu, Chief Research Scientist - China Mobile Research Institute

Plenary Session

  • Junde Song, Beijing University of Posts and Telecommunications and EDI CON 2014 Chair Emeritus – China's six major applications that will drive RF / microwave, EMC / EMI, RFID, High-Speed digital IC & devices CAD System development.
  • ERPING LI, RF and Nanoelectronics Research Center, Zhejiang University - Electrical Design Challenges of TSV Based 3D Integrated Circuits and Systems
  • Keming Feng, Beijing Institute of Radio Metrology and Measurement - Research in Commercial RADAR Systems for Detection of  Undergound Objects
  • Mario Narduzzi, Agilent Technologies (Host Sponsor) - TBA
  • Corbet Rowell, China Mobile Research - 5G Cellular Challenges
  • Mario Narduzzi, Agilent Technologies (Host Sponsor) - TBA
  • Deng Jie, ZTE - TBA
  • James Kimery, National Instruments (Corporate Sponsor) – 5G Wireless: A New Frontier
  • Josef Wolf, Rohde & Schwarz (Diamond Sponsor) – 5G: The Next Challenge for Test and Measurement

View EDI CON 2014 Conference Schedule