A new kind of technical conference and trade show, developed for and by the
high-frequency/high-speed electronics industry and Microwave Journal China.
Four morning sessions are divided into three concurrent juried technical tracks. Each session will feature two twenty-minute long technical papers from selected or invited contributors. The technical tracks focus on a range of high frequency/high speed electronic design issues from component characterization through system integration. A fourth track focuses on commercial applications.
As a "smart" show, EDICON relies on engineers, designers and application technologists to co-develop the content for the conference program. The technical advisory committee is responsible for reviewing the papers submitted to EDI CON. The technical advisory committee members have expertise in the areas of EM, circuit and system simulation, test verification, RFIC, MMIC and RF/high-speed semiconductors, passive components, and system integration.
The committee, through the guidance of the TPC technical advisors and the Program Chairs, does most of the intellectual design and abstract solicitation for the conference. The committee also helps to develop and organize special focus panel sessions, workshops, tutorials and corporate seminars which are equally to the standard conference program. By working with industry-leading solution providers and their customers, the EDICON organizers are focused on developing a horizontal show that attracts a broad range of high-valued visitors with direct interest in solutions for RF, Microwave and high-speed digital design.
Track 1: High Frequency & High Speed Design
Co-chairs: Milton Lien (AWR) and Wei Liu (Mitron)
Track 2: Measurement & Modeling
Co-chairs: Jian-Yu Li (Agilent) and Klaus Krohne (CST)
Track 3: Systems Engineering
Co-chairs: Dr. Adams An (Rohde & Schwarz) and Ding HaiQiang (ANSYS)