EDI CON CHINA organizers encourage industry engineers to share their technical expertise with an audience looking for training in RF, microwave, signal integrity, power integrity, and EMC/EMI.
September 24, 2019 (Norwood, MA.) – EDI CON China 2020 will provide a forum for engineers to share their expertise and discuss new design methodologies with colleagues during this year’s conference. Attendees will also have the opportunity to see award-winning products and talk with industry-leading vendors at the adjacent exhibition on October 13-14, 2020 at the China National Convention Center (CNCC) in Beijing, China. Now in its eighth year, EDI CON CHINA continues to be the largest microwave and high-speed digital design conference and exhibition in China.
The technical sessions and panels will be organized around tracks focused on 5G, test and measurement, radar/communications, amplifiers, RF/microwave, measurement and modeling, signal integrity, and power integrity.
EDI CON technical sessions are educational, providing information on how to address design challenges using available materials, tools, products, and techniques. The 30-minute sessions held October 13-14 are based on peer-reviewed abstracts and papers that have been evaluated by the EDI CON Technical Advisory Committee. To participate, submit a detailed abstract for consideration by January 6th.
Abstracts are judged based on quality, relevance, impact, and originality. Good examples of abstracts include ones that report on important results, methodologies or case studies. It is acceptable to reference products in a design case study or as a proof of concept for a design methodology, but advertising and product promotion is not acceptable in session proposals.
More information, including instructions on how to submit an abstract and an application to exhibit, is available at www.ediconchina.com.