EDI CON China Technical Sessions Call for Papers

Welcome experts, scholars and engineers in the industry to submit articles

Submit an Abstract

EDI CON contains technical sessions and sponsored workshops. Technical sessions are educational, providing information on how to address design challenges using available materials, tools, products, and techniques. The technical sessions are based on peer-reviewed abstracts and papers that have been evaluated by the EDI CON Technical Advisory Committee. They can be given in Chinese or English, English speakers should provide their own translators, and EDICON will provide the necessary assistance.

Evaluation Criteria

Abstracts are judged based on quality, relevance, impact, and originality. Good examples of abstracts include ones that report on important results, methodologies or case studies. It is acceptable to reference products in a design case study or as a proof of concept for a design methodology, but advertising and product promotion is NOT acceptable in session proposals.

Speaker Benefits & Responsibilities

If accepted into the program, speakers receive free admission to all technical sessions, workshops, and exhibition. If a speaker cannot attend, he or she should tell conference management and provide a substitute speaker from his or her work group or company. You must notify event management of any substitutions. Papers accepted by EDI CON will appear in the conference proceedings provided to delegates or made available through purchase from Microwave Journal and EDI CON. Accepted papers are eligible for publication by Microwave Journal, Signal Integrity Journal, and/or Microwave Journal China.

Submit an Abstract

Proposed Topics

• 5G/6G technologies such as RedCap, NTN, mmWave, THz, etc.
• LEO satellite communications
• IoT technologies such as Matter, BLE, Thread, etc.
• Test & measurement for advanced technologies
• Design, modeling and simulation software
• New antenna/packaging technologies: MIMO, AiP, RIS, etc.
• Software defined radios
• Advanced semiconductor technologies such as GaN, SiC, SOI, etc.
• High speed and high frequency interconnects
• The application of machine learning and AI
• Wi-Fi 6/Wi-Fi 7
• Navigation and position technologies including outdoor and indoor
• Automotive and V2X
• New Radar and EW technologies
• New materials, passive and active components
• Defense and aerospace applications of MW/RF
• Biomedical applications of MW/RF

Final Paper & Presentation Submissions

If a proposal is accepted, the author is required to submit a presentation by the final materials deadline (submitting a paper is optional). Presentations and papers will be available to all EDI CON conference delegates in the technical proceedings. Technical papers should be between 2,000 and 3,000 words. They can contain mathematical formulas as well as a maximum of six images.

Submit an Abstract

For details:Winson Xing, winsonx@actintl.com.hk