EDI CON is an opportunity for design engineers and system integrators to learn about the latest RF/microwave and high-speed digital products and technologies for today’s communication, computing, RFID, industrial wireless monitoring, navigation, aerospace and related markets. With a focus on applications, emerging technologies, and practical engineering solutions, this annual event brings together the designers at the forefront of innovation and the world’s leading multi-national technology companies. EDI CON includes keynotes presentations from industry executives and government officials, technical presentations, workshops, expert panels, an exhibitor showcase, and a networking reception. The event will be held in spring 2024 at the China National Convention Center in Beijing, China.