The conference & exhibition will take place April 1-3 in Beijing
November 7, 2018 (Norwood, MA.) – EDI CON China 2019, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place April 1-3, 2019 at the China National Convention Center (Beijing, China), announces the Call for Abstracts for its technical sessions is open. The EDI CON CHINA Technical Advisory Committee evaluates all submitted abstracts for quality and educational relevance for conference attendees.
In its seventh year, EDI CON China 2019 will include technical conference sessions as well as workshops, panels, keynotes, and demonstrations from industry leading exhibitors in the RF, microwave, and high-speed digital industries. Authors wishing to submit an abstract can do so here. Talks can be given in English or Chinese, and the event will provide real-time translation from English to Chinese for native language engineers.
Focused on providing actionable information to practicing engineers, EDI CON offers specialized conference tracks to appeal to engineers looking for in-depth technical information to address today’s design challenges. Planned tracks include 5G and Blockchain Technologies, 5G/Advanced Communications , mmWave Technologies, RF/Microwave Amplifier Design, EMC/EMI, Low Power RF and IoT, Front End Design, Power Integrity, Radar and Defense, RF and Microwave Design, Signal Integrity, Simulation and Modeling, and Test and Measurement.
To be selected as part of the EDI CON China 2019 technical program, abstracts must provide a sufficient level of technical detail for the Technical Advisory Committee. Submissions should be high quality and detailed, aimed at advancing the knowledge of attendees. Abstracts will be evaluated on quality, relevance, impact, and originality. While prospective authors can reference products in a design case study or as a proof of concept for a design methodology, overt commercial content is not acceptable in session proposals.