Finalists announced before the event; winners announced April 2nd in Beijing at the China National Convention Center
December 12, 2018 (Norwood, MA.) – EDI CON China 2019, taking place April 1-3, 2019 at the China National Convention Center (Beijing, China), is accepting nominations for the second annual EDI CON Product Innovation Awards. The awards recognize the best of the best products on display at the annual exhibition.
EDI CON CHINA brings together speakers, exhibitors, and engineers who are focused on high-frequency analog and high-speed digital designs. The EDI CON Product Innovation Awards honor those products introduced in the last year that have had the greatest impact on the industry, providing the tools necessary to bring on the next generation of electronic design innovations.
Nominations are free and open to all EDI CON CHINA 2019 exhibitors. Winners will be announced on the exhibit hall floor at EDI CON CHINA in the Frequency Matters Theater on Tuesday April 2, 2019 at the China National Convention Center in Beijing, China.
Products must have been released to the market between January 1, 2018 and December 31, 2018. A panel of Microwave Journal and Signal Integrity Journal editors and EDI CON advisory board members will select up to 15 finalists, 3 in each category. The finalists will be featured in articles on Microwave Journal, Microwave Journal China, and Signal Integrity Journal online and will receive signs for display in their booths at EDI CON CHINA 2019. Entries are judged on exceptional innovation, including consideration of product functionality, ease of use, cost effectiveness, and other factors.
Categories:
- Test & Measurement
- Software/EDA
- Semiconductors
- Components, Cables, & Connectors
- Materials, PCBs and Packaging
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