Winners were announced at the event on April 2nd in Beijing, China.


April 3, 2019 (Norwood, MA.) – On April 2, EDI CON China 2019 announced the winners and presented the trophies to company representatives in its second annual EDI CON CHINA Product Innovation Awards. The ceremony was presided over by Winson Xing, Editor Microwave Journal China, and Carl Sheffres, Publisher of Microwave Journal & Exhibition Manager.

The EDI CON Product Innovation Awards honor products introduced in the last year that have had the greatest impact on the industry, providing the tools necessary to bring on the next generation of electronic design innovations. EDI CON offers congratulations to the engineers and companies who developed these notable winning products:

Components, Cables, & Connectors Winner:

  • TMY Technology Inc., Phase-locked oscillator

Software/EDA Winner:

  • National Instruments/AWR, Network Synthesis Wizard

Semiconductors Winner:

  • Analog Devices, ADRV9009 RF Transceiver

Test & Measurement Winner:

  • Hongke Technology Co., LTD, Handheld Microwave Spectrum Analyzer for 70-87GHz

Materials, PCBs, & Packaging Winner

  • WIN Semiconductors, MW plastic QFN Package Series

A panel of Microwave Journal and Signal Integrity Journal editors selected the finalists and winners from nominated products. The third annual awards will occur at EDI CON CHINA 2020 which will take place the week of October 13, 2020 at the China National Convention Center, Beijing, China.

About EDI CON
Celebrating its seventh year in 2019, EDI CON China uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today’s communication, consumer electronics, aerospace, and medical industries. The exhibition hall features product displays, demonstrations, and applications talks while the conference hosts educational technical sessions, panels, and workshops that address all aspects of design, simulation, test, and verification.

About the Organizers
EDI CON China is organized by Microwave Journal, Signal Integrity Journal, and Microwave Journal China, the event planning division of its parent company Horizon House, and ACT International (Hong Kong), a publisher of BtB media in Asia serving multiple technology markets including Microwave Journal China. Horizon House is an experienced and well-established organizer of targeted events, including major conferences/exhibitions such as EDI CON USA as well as the European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), orchestrating these events’ long-term development and growth. The program is developed in collaboration with leading international technology companies in the areas of RF/microwave and high speed digital ICs, components, test and measurement, software, cables/connectors, systems, and services.

EVENT MANAGEMENT:
Michel Zoghob, Event Director
mzoghob@horizonhouse.co.uk

EXHBITION/SALES CONTACTS:
Carl Sheffres, Exhibition Manager
+1-781-619-1949
csheffres@mwjournal.com
Adonis Mak
ACT International
(852) 28386298
adonism@actintl.com.hk

TECHNICAL PROGRAM CONTACT:
Janine Love, Technical Program Director
+1-857-350-2216
jlove@horizonhouse.com
Twitter: @tb_janine