EDI CON China celebrates electronic design innovation, bringing together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities.
Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries.
Drawing attendees from both the analog and digital spheres, with special focus on EMC and Radar through its partnerships, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges.
The exhibition hall features product displays, demonstrations, networking opportunities, and poster sessions that address all aspects of design, simulation, test, and verification.
March 5, 2017 - Final Materials Due
April 25-27, 2017 - Conference at Shanghai Convention & Exhibition Center, Shanghai, China
The China Radar Industry Association (CRIA) Conference, in partnership with the CCPIT Commercial Sub-council, will co-locate with EDI CON China. The CRIA was established in 1990 and is located in Beijing. It is a non-profit social organization consisting of many enterprises and institutions, colleges and universities and users, that are involved in electronic information technology, system engineering, radar, communications, navigation, surveillance, identification, electronic warfare, air traffic control, water and land transport, computers, etc. The CRIA has more than 400 members all over China, distributed in the Chinese Academy of Sciences, aerospace, aviation, ships, defense, electronic information, transportation, railway, civil aviation, meteorology, universities, trade and other systems and fields. For more information, contact Mrs. Yan Ruihua at 86-10-68652457 or 86-13801174492 (firstname.lastname@example.org) or visit their web site at www.chinaradar.org.cn.
The technical sessions and workshops offer insights and instruction on electronic design tools and techniques. Each session includes a twenty-minute long technical talk from invited contributors or selected from papers submitted to the EDI CON Technical Advisory Committee. The technical tracks focus on a range of high frequency/high speed electronic design issues from component characterization through system integration.
The 2016 conference included 80 peer-reviewed papers, 30 workshops, 2 panel sessions, and 5 keynote talks from industry leaders.
Invited and submitted papers are reviewed by the EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of EMC, circuit and system simulation, test verification, RFIC, MMIC and high-speed semiconductors, passive components, and system integration. The technical sessions are organized around tracks focused RF & Microwave Design, High-Speed Digital Design, Measurement & Modeling, Systems Engineering, and 5G Advanced Communications.
Workshops (40 minutes) allow industry experts to share information on specific challenging and emerging topics related to high frequency or high-speed electronic design. Workshops are an interactive experience, allowing time for audience questions and may include demonstrations of design software and/or measurement equipment. Sponsors are responsible for workshops content according to the guidelines set by the EDI CON organizers.
In these 40-minute sessions, a panel of experts discusses a particular topic of interest. After an opening statement introducing his or her perspective on the forum topic, a moderator engages panelists in a deeper discussion that is driven by questions from the audience. EDI CON organizers and panel sponsors are responsible for coordinating the panel topics, invited speakers, and moderator. This year's planned panels include: To Be Announced.
EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other shows with a separate more academic focused conference, EDI CON has industrial and technology leaders delivering most of the technical sessions, workshops and panels so that the exhibition is closely coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.
EDI CON China 2017 Announces Keynote and Panels
February 1, 2017 – Norwood Massachusetts: EDI CON China, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place April 25-April 27, 2017 at the Shanghai Convention Center & Exhibition Center of International Sourcing (Shanghai, China), announces the keynote speaker for this year’s event will be Peter Rabbeni, Sr. Director RF BU Product Marketing at GLOBALFOUNDRIES.
EDI CON China 2017 Opens Call For Papers
August 1, 2016 – Norwood Massachusetts: EDI CON China 2017, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place April 25-April 27, 2017 at the Shanghai Convention Center & Exhibition Center of International Sourcing (Shanghai, China), announces the Call for Papers is open.
EDI CON China 2016 Achieves Record Attendance
April 26, 2016 – Norwood Massachusetts: EDI CON China took place at the China National Convention Center in Beijing, China on April 19-21, 2016 with record-setting attendance at the largest microwave, EMC/EMI and high-speed digital design conference and exhibition in China..
EDI CON China 2016 Adds RF Silicon on Insulator Track and Keynote
March 17, 2016 – Norwood Massachusetts: EDI CON China 2016, taking place April 19-21 in Beijing at the China National Convention Center (CNCC), is pleased to announce that GLOBALFOUNDRIES' Peter Rabbeni, Sr. Director, RF BU Business Development & Product Marketing, will kick off the newly added RF Silicon on Insulator (SOI) Technology Track with a keynote talk entitled, "RF SOI: Revolutionizing Radio Design Today and Driving Innovation for Tomorrow."