A new kind of technical conference and trade show, developed for and by the
high-frequency/high-speed electronics industry and Microwave Journal China.
April 2014
Beijing, China
www.EDICONCHINA.com
EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.
2013 PLENARY SESSION PRESENTATIONS
Keynote talks from Honorary Chair, Dr. Professor Song Junde of BUPT, Guy Sene, President of EMG, Agilent Technologies (Platinum Sponsor), Guang Yang, Senior Mobile Communications Analyst, Strategy Analytics, Bertrum Arbesser-Rastburg, Head ESA-ESTEC, Dr. Guangyi Liu, senior Researcher, China Mobile Research Institute, Deng Jie, General Manager, ZTE Microwave Products Group and Feng Keming, General Director Beijing Institute of Radio Metrology and Measurement.
2013 TECHNICAL PROGRAM
The peer-reviewed technical paper sessions offer three tracks addressing:
- Design
- Measurement & Modeling
- System Engineering
Invited and submitted papers are reviewed by the EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of EM, circuit and system simulation, test verification, RFIC, MMIC and high-speed semiconductors, passive components, and system integration. In addition, the morning technical program will have a fourth track on commercial resources featuring sponsored papers.
Download 2013 conference schedule
2013 WORKSHOPS
Workshops provide a forum for industry practitioners to share information on specific challenging and emerging topics related to high-frequency/high-speed electronic design. Workshop sponsors are responsible for developing the content according to the guidelines set by the EDI CON organizers. Workshops are an interactive experience, allowing extra time for audience questions and participation, which may include demonstrations and opportunities to work with design software and/or measurement equipment.
Workshops in development include: TD-LTE • 802.11ac • Carrier Aggregation • NFC • High-Speed Data Converters • FPGAs for Wireless Communications • RFICs • Front-ends • SATCOM • Radar Systems • EMC/EMI
2013 FORUMS/PANELS
Forums feature presentations from a panel of experts followed by a joint question and answer session with audience members. Each 60 minute session will include three panelists, recognized for their expertise in their respective fields. Each panelist will give a 15 minute presentation on the challenges and potential solutions impacting a specific technology or application followed by a question and answer session. The conference organizers and individual panel sponsors are responsible for coordinating the panel topic and invited speakers.
Current scheduled forums include:
- MIMO OTA (sponsored by Spirent)
- The GaN Panel (90 minutes, limited to 5 co-sponsors)
- Connectivity Forum (3 hour slot of technical sessions
To sponsor a panel, contact your local Microwave Journal or Microwave Journal China representative
2013 EXHIBITION
EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other shows with a separate more academic focused conference, EDI CON has industrial and technology leaders delivering most of the technical sessions, workshops and panels so that the exhibition is closely coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.
IMPORTANT DATES
July 1, 2013 - Initial Call for Papers and Invitations to submit
September 30, 2013 - Material deadline for submitting paper proposals, including title and abstract/summary, author bio/pic. initial drafts also accepted
October 31, 2013 - Notification of acceptance
January 30, 2014 - Final manuscript due
NEWS
EDI CON 2013: First-ever Electronic Design Innovation Conference Deemed a Huge Success
Horizon House and ACT International held the first annual Electronic Design Innovation Conference (EDI CON) and exhibition March 12-14 in Beijing, China, where high-frequency electronic design engineers from around the globe converged for two and-a-half days of intensive technical learning and networking opportunities.
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AWR Sponsors and Exhibits at EDICON 2013; Presents a Wide Array of Technical Papers and Workshops
AWR is a gold sponsor at the Electronic Design Innovations Conference ( EDI CON) 2013, which runs from March 12 -14 in Beijing, China. Together with parent company National Instruments, AWR will be showcasing at Booth #255 joint hardware/software solutions, as well as the first update in 2013 of the AWR Design Environment™, inclusive of Microwave Office®/Analog Office® circuit design software, Visual System Simulator™ (VSS) system design software, as well as AXIEM® 3D planar electromagnetic (EM) software and Analyst™ 3D finite element method (FEM) EM software.
Read More
EDI CON 2013 Connectivity Workshop and Expert Panel to Explore Application-based Solutions
EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design organized by Microwave Journal and Horizon House has announced a special workshop focusing on connectivity challenges and innovations for high-frequency systems and instrumentation equipment to be held on March 14th at the Beijing International Convention Center.
Read More
EXHIBITORS
EDI CON exhibitors are at the forefront of high frequency electronic design, providing the technology solutions and products that are used by engineers in the design of next generation systems addressing the telecommunications, computing, aerospace and wireless consumer electronics sectors.