A new kind of technical conference and trade show, developed for and by the high-frequency/high-speed electronics industry and Microwave Journal China.
June 15, 2012:
Conference registration opens. Early registration discount ends 12/31/12.
August 1, 2012:
Deadline for Papers and Workshop Submittal
Sept. 30, 2012:
Acceptance of Papers
Nov. 1, 2012:
Final Conference Program
March 12-14, 2013:
Electronic Design Innovations Conference
EDI CON 2015 April 14-16, 2015 Beijing, China
EDI CON 2015 moves to CNCC to Accommodate Growth Organizers of the Electronic Design Innovation Conference (EDI CON) have signed a contract with the China National Convention Center (CNCC) to host this industry-driven event for RF, microwave and high speed digital electronic designers on April 14-16, 2015 in Beijing, China. The venue change is necessary to accommodate the expected growth in the number of vendors participating in the exhibition next year. The success of the event this past April, which included record attendance and a sold out exhibition, led to the decision to move the event to the larger, newer facility. Read More
EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.
The sessions offered are designed to provide knowledge of electronic design tools and techniques. The technical sessions are divided into three concurrent technical tracks. Each session will feature two twenty-minute long technical papers from invited contributors or selected from papers submitted to the EDI CON Technical Advisory Committee. The technical tracks focus on a range of high frequency/high speed electronic design issues from component characterization through system integration.
3 Day peer-reviewed industry-focused technical conference
95 peer reviewed papers
2 panel sessions
7 keynote talks from Industry executives, leading researchers and academics
Invited and submitted papers are reviewed by the EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of EMC, circuit and system simulation, test verification, RFIC, MMIC and high-speed semiconductors, passive components, and system integration. The technical sessions are organized around tracks focused on RF, microwave and high-speed digital design, RF/mW measurement and modeling, EMC/EMI, high-speed digital measurements and modeling, system-level measurements and modeling, system engineering and commercial resources.
Workshops provide a forum for industry practitioners to share information on specific challenging and emerging topics related to high-frequency/high-speed electronic design. Workshop sponsors are responsible for developing the content according to the guidelines set by the EDI CON organizers. Workshops are an interactive experience, allowing extra time for audience questions and participation, which may include demonstrations and opportunities to work with design software and/or measurement equipment.
EDI CON 2015 will feature special expert panels discussing specific topics impacting technology today. Led by a moderator with interaction from audience members, experts will provide a brief overview of their position on the challenges and potential solutions impacting a specific technology or application. Past panel themes included the State of GaN in China, MIMO OTA test, EDA design flows, Aligning RF semiconductor technology to end-use applications, and Trends in future telecommunications systems and their engineering challenges.
EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. This year’s exhibition doubles the size of 2013 with twice the exhibition space and number of exhibitors. The exhibition halls feature test and measurement equipment and simulation software (EDA) vendors in the west hall and semiconductor, integrated device manufacturers, materials, components and distributors in the east hall. A schedule of events in the exhibition will ensure a lively and productive exchange between vendors and attending engineers.
November 30, 2014: Material deadline for submitting paper proposals
December 30, 2014 - Notification of acceptance
February 28, 2015 - Final materials due
March 31, 2015 - Registration discount ends
NI to Showcase NI AWR Design Environment Software at EDI CON 2015 March 26, 2015 – Norwood Massachusetts:
NI (formerly AWR Corp.) will be showcasing NI AWR Design Environment™ software at Booth #315 at the Electronic Design Innovation Conference 2015 (EDI CON), being held April 14-16 in Beijing, China. Read More
MACOM to Showcase Industry Leading Product and Technology Portfolio at EDI CON 2015 in Beijing, China March 25, 2015 – Norwood Massachusetts: M/A-COM Technology Solutions Inc. ("MACOM"), a leading supplier of high-performance analog RF, microwave, millimeter wave and photonic semiconductor products, will showcase a broad portfolio of new products for multi-market, aerospace, defense and networking applications at Booth #321 at EDI CON 2015 in Beijing, China. Read More
EDI CON Adds 5G Advanced Communications Forum to Conference Norwood, Ma - January 7, 2015 : Horizon House Publications and Microwave Journal China are pleased to announce that EDI CON 2015, taking place April 14-16, has added a 5G Advanced Communications Forum to the conference schedule. The 5G Forum will be a full day of sessions taking place on April 15 at the China National Convention Center (CNCC). Read More
EDI CON exhibitors are at the forefront of high frequency electronic design, providing the technology solutions and products that are used by engineers in the design of next generation systems addressing the telecommunications, computing, aerospace and wireless consumer electronics sectors.